MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of ALPHA OM-220, its latest innovation in low-temperature solder technology.
ALPHA OM-220 was developed in response to the ever-increasing complexity of electronic assemblies and incorporation of heat-sensitive components. Featuring the ULT1 alloy, this innovative solder chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. The lower reflow temperatures enable use of lower cost substrates and components and reduced warpage on both components and substrates compared to traditional SAC processes. Additionally, ALPHA OM-220 has demonstrated excellent electrical reliability, having passed JIS Z 3197 & J-STD-004B SIR testing, and exhibits low voiding characteristics, having passed IPC Class 3 voiding on BGA components.
Another characteristic of ALPHA OM-220 is that it permits cascaded or hierarchical soldering, as well as novel hermetic sealing solutions. “This solder paste is designed to respond to the growing needs for low-temperature processing and we are pleased to bring to market a solution that provides our customers efficiencies in both energy use and materials cost,” said Rahul Raut, Director of Strategy and Acquisition at MacDermid Alpha. “This technology is well suited for a broad range of applications involving temperature-sensitive assemblies, such as consumer electronics, in-cabin automotive electronics and medical devices.”
ALPHA OM-220 is safe and environmentally friendly to use. It is both halide-free and zero-halogen compliant and meets the latest RoHS and REACH standards for compliance.
For more information please visit MacDermidAlpha.com.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.
Rahul RautBawa Singh
Director, Strategy & Technical AcquisitionExecutive VP, Tech. & Corporate Development